Husqvarna 3-Pack 20 Grit Soft Bond Double Arrow Diamond Segments for Epoxy Glue Concrete Removal with Redi Lock PG Grinders

Fast Starts, Clean Finishes Double Arrow Segments for Epoxy, Glue, and Hard Surface Removal with Redi Lock PG Grinder Systems

Engineered for aggressive removal of epoxy, glue, and coatings on hard concrete surfaces, the Husqvarna Redi Lock 20G Double Arrow Segments (Part No. 585672404) deliver fast cutting action with controlled startup. The arrow-shaped design reduces contact surface for quicker engagement, while the soft bond matrix ensures optimal performance on dense substrates.

Ideal for demolition and surface prep across concrete, brick, staircases, balconies, and sensitive architectural zones, these segments are compatible with older Redi Lock plate heads (not compatible with Wing-Style PG plates). The EZchange system eliminates screws and fasteners, allowing for rapid tool swaps and uninterrupted workflow. Whether you’re stripping coatings or prepping for overlays, this 3-pack offers OEM-grade durability and precision grinding.

Key Benefits and Features

• Soft bond diamond matrix for hard concrete and dense surface removal
• 20 grit rating for aggressive epoxy and glue removal
• Double arrow segment design for fast starts and controlled grinding
• Hexagonal geometry promotes smoother, active grinding performance
• EZchange system allows tool-free segment replacement
• Compatible with older Redi Lock PG grinder plates
• Not compatible with Wing-Style PG plate heads
• Ideal for demolition, surface prep, and sensitive architectural zones

What’s Included

• (3) Husqvarna Redi Lock 20G Double Arrow Diamond Grinding Segments Part No. 585672404

Specifications

[‘Grinding Discs’]